Practical study of temperature distribution in a thermal test integrated circuit

摘要

This paper presents measurements and simulations of a test integrated circuit. The circuit contains a matrix of heat sources and a set of temperature sensors, what renders possible measurement of circuit temperature in real cooling conditions inside a closed package. The measurements are validated for different patterns of power dissipation and cooling conditions with numerical simulations. Based on the presented results, the influence of circuit topology on temperature distribution and its impact on the possibility of heat source temperature estimation are discussed.