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Evaluation of pH under-deposit using the dual-cell technique in flow conditions - The case of CuNi 70:30 in high bacteria contaminated freshwater

机译:在流动条件下使用双池技术评估pH不足的沉积物-高细菌污染的淡水中CuNi 70:30的情况

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Copper alloys are widely used in cooling circuits due to their corrosion resistance, mechanical workability, and excellent electrical and thermal conductivity. Copper was believed to be immune to microbial corrosion because its toxicity to the biological organisms, but it is well known that this material suffers of this kind of corrosion.rnBiofilms modifies the local environment at the biofilm/alloy interface; the local environment can be radically different from that of the bulk medium in terms of pH, dissolved oxygen, and different ions concentrations that build at the interface coming from the metal and/or the electrolyte as a direct action of the bacteria.rnWe investigate the effect of pH changes on CuNi 70:30 samples clean and covered with a biofilm. Experiments were carried out in a hydraulic circuit built in a wastewater treatment plant, after the depurative process and before the sanitization treatment. The methodology consisted in measuring the coupling current between two copper alloy samples (electrodes), one covered by biofilm and other clean (no biofilm); both immersed in the hydraulic loop and with the same electrolyte characteristics. A current, measured with a zero resistance ammeter, will be detected between the two electrodes (biofouled vs. clean sample). Our hypothesis is: if the current is prevalently due to a lower pH under the biofouled interface (biofouled sample vs clean one), it will become gradually smaller as the pH in the cell compartment with the clean sample is decreased. The results showed that, decreasing the pH in the cell compartment containing the clean sample has a significant impact on the coupling current, as it is expected. The measurement performed indicated that a zero current between the two electrodes cannot be reached at pH higher than 4. This may indicate that CuNi passive film, under the biofilm samples, may change not solely due to the pH changes; i.e. pH is not the only variable affecting the corrosion formed under biofilm. The possible complex role of the pH on the cathodic and anodic reactions is discussed.
机译:铜合金由于其耐腐蚀性,机械加工性以及出色的导电性和导热性而被广泛用于冷却回路中。人们认为铜对微生物具有免疫力,因为它对生物具有毒性,但是众所周知,这种材料会遭受这种腐蚀。生物膜改变了生物膜/合金界面的局部环境;就细菌的直接作用而言,就pH值,溶解氧和在金属和/或电解质产生的界面处建立的不同离子浓度而言,本地环境可能与大容量介质完全不同。 pH值变化对清洁且覆盖有生物膜的CuNi 70:30样品的影响。在净化过程之后和消毒处理之前,在废水处理厂的液压回路中进行了实验。该方法包括测量两个铜合金样品(电极)之间的耦合电流,其中一个被生物膜覆盖,而另一个被清洁(无生物膜)覆盖。两者均浸入液压回路并具有相同的电解质特性。将在两个电极之间检测到用零电阻电流表测量的电流(生物污染与清洁样品之间的关系)。我们的假设是:如果电流主要是由于生物污损界面下的pH值较低(生物污损样品与清洁样品之间的pH值),则随着清洁样品在细胞室中的pH降低,电流将逐渐变小。结果表明,如预期的那样,降低包含干净样品的细胞室中的pH对耦合电流有重大影响。进行的测量表明,在高于4的pH值下,两个电极之间无法达到零电流。这可能表明,生物膜样品下的CuNi钝化膜可能不仅由于pH值的变化而变化,而且还可能由于pH值的变化而改变。即pH值不是影响生物膜下形成腐蚀的唯一变量。讨论了pH在阴极和阳极反应中可能的复杂作用。

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