Advanced Electronic Materials Lab.,College of Materials Science and Engineering,Beijing University of Technology,Beijing 100124,P. R.China;
China Building Material Test Certification Center,Beijing 100024,P. R.China;
Advanced Electronic Materials Lab.,College of Materials Science and Engineering,Beijing University of Technology,Beijing 100124,P.R.China;
Advanced Electronic Materials Lab.,College of Materials Science and Engineering,Beijing University of Technology,Beijing 100124,P. R.China;
Advanced Electronic Materials Lab.,College of Materials Science and Engineering,Beijing University of Technology,Beijing 100124,P. R.China;
Department of Mechanics,Tsinghua University,Beijing 100022,P. R.China;
Solderjoint; 3-D shape simulation; eutectic Sn-Pb solder;
机译:回流凝固过程中焊点形状和温度场演变的模拟
机译:回流焊过程中焊点形状演变的模拟及其实验验证
机译:混合实验-计算方法确定焊点中的焊料/ IMC界面剪切强度
机译:回流焊接后关节形状的计算模拟
机译:计算有效的区域阵列焊点疲劳寿命预测:基于经验的模型和基于损伤的模型的比较。
机译:形式跟随功能:关于骨骼形状形成和保存的计算模拟练习
机译:BGA焊点的焊料形状预测及残余应力评价。