首页> 外文会议>Symposium on Thin-Films - Stresses and Mechanical properties Vii, held December 1-5, 1997, Boston, Massachusetts, U.S.A. >Residual stress generation during constrained sintering of layered ceramic thin-film structures
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Residual stress generation during constrained sintering of layered ceramic thin-film structures

机译:层状陶瓷薄膜结构的约束烧结过程中残余应力的产生

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This work investigates the sintering kinetics and residual stresses which develop in thin layered ceramic structures when sintered on a rigid substrate. A continuum constitutive framework to model the evolution of the microstructure and stresses in the sintering layers under non-isothermal conditions is presented. The sintering model is used to investigate the constrained sintering behaviour of layered ceramic structures used in solid oxide fuel cells (SOFC). Samples of a 50 mu m thick SOFC film were screen-printed on a fully dense yttria-stabilised zirconia substrate and then sintered at temperatures ranging from 1100 deg C to 1300 deg C. Measured values of relative density and average grain size are compared with model predictions. A correlation between residual stresses extracted from curvature measurements and analytical predictions revealed these stresses to have been mostly relieved during the subsequent cooling by microcrack formation.
机译:这项工作研究了在刚性基板上烧结时在薄层陶瓷结构中产生的烧结动力学和残余应力。提出了一个连续的本构框架,以模拟非等温条件下烧结层的微观结构和应力。烧结模型用于研究固体氧化物燃料电池(SOFC)中使用的层状陶瓷结构的约束烧结行为。将50微米厚的SOFC膜样品丝网印刷在完全致密的氧化钇稳定的氧化锆衬底上,然后在1100℃至1300℃的温度下烧结。将相对密度和平均晶粒度的测量值与模型进行比较预测。从曲率测量结果提取的残余应力与分析预测之间的相关性表明,在随后的冷却过程中,由于微裂纹的形成,这些应力大部分已得到缓解。

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