首页> 外文会议>Symposium on Thin-Films - Stresses and Mechanical properties Vii, held December 1-5, 1997, Boston, Massachusetts, U.S.A. >Microstructural effects on the hardness, elastic modulus, and fracture toughness of CVD diamond
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Microstructural effects on the hardness, elastic modulus, and fracture toughness of CVD diamond

机译:显微组织对CVD金刚石的硬度,弹性模量和断裂韧性的影响

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摘要

The hardness, elastic modulus, and fracture toughness of chemical vapor deposited (CVD) polycrystalline diamond have been investigated on several thick (approx 100 mu m) free-standing films with regard to the grain size, impurity content and failure mechanisms. Micro-hardness measurements using Vickers indentation, in conjunction with Young's modulus measurement techniques such as nano-indentation, were employed to estimate the indentation fracture toughness. The toughness of CVD diamond was increased through the addition of non-diamond carbon, which promoted intergranular fracture and enhanced the toughness by grain bridging.
机译:研究了化学气相沉积(CVD)多晶金刚石的硬度,弹性模量和断裂韧度,研究了几层厚(约100微米)的自支撑膜的晶粒尺寸,杂质含量和破坏机理。使用维氏压痕进行显微硬度测量,并结合杨氏模量测量技术(例如纳米压痕)来估算压痕断裂韧性。通过添加非金刚石碳可增加CVD金刚石的韧性,从而促进晶间断裂并通过晶粒桥接增强韧性。

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