首页> 外文会议>Symposium on Processing and Fabrication of Advanced Materials; 20031013-20031015; Pittsburgh,PA; US >Thermoelectric Properties of ReSi_(1.75) Based Silicides ―Property Improvements Through Defect Engineering
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Thermoelectric Properties of ReSi_(1.75) Based Silicides ―Property Improvements Through Defect Engineering

机译:ReSi_(1.75)基硅化物的热电特性―通过缺陷工程改进性能

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(1) The crystal structure of ReSi_(1.75) is determined to be monoclinic with the space group Cm (mc44) due to the ordered arrangement of vacancies on Si sites in the underlying C11_b lattice. The crystal contains four differently oriented domains; two domains related with each other by the 90°-rotation about the c-axis of the underlying C11_b lattice and twin domains for each of the two domains. (2) Upon alloying ReSi_(1.75) with Mo, an incommensurate microstructure, in which two block layers with different chemical compositions and vacancy concentrations stack randomly along in the parent C11_b lattice, appears. (3) Upon alloying ReSi_(1.75) with Ru, a shear-type microstructure, in which two neighboring domains are sheared (shifted) with each other on (101) by the vector of 1/8 in order to increase the Si vacancy concentration, appears. (4) The thermoelectric properties of ReSi_(1.75) are highly anisotropic. The value of electrical resistivity is higher for along than for. Its electrical conduction is of n-type when measure along while it is of p-type when measured along. Such anisotropy may come from anisotropy in the electronic structure due to its rather complicated crystal structure as well as from a complex microstructure. (5) Although the value of Seebeck coefficient along is moderately high (150-200 μV/K), it is very high along (250-300 μV/K). The value of thermal conductivity is rather isotropic and reasonably small. As a result, a very high value of dimensionless figure of merit (ZT) of 0.7 is achieved at 1073 K when measured along. The ZT value is further increased to 0.8 with a small amount (2% substitution for Re) of Mo addition.
机译:(1)由于在下面的C11_b晶格中Si位点上的空位有序排列,因此ReSi_(1.75)的晶体结构被确定为具有空间群Cm(mc44)的单斜晶。晶体包含四个不同取向的畴;通过围绕基础C11_b晶格的c轴旋转90°彼此相关的两个域和两个域中的每一个的孪生域。 (2)在将ReSi_(1.75)与Mo合金化后,出现了不相称的微观结构,其中两个具有不同化学成分和空位浓度的嵌段层随机沿母体C11_b晶格堆叠。 (3)在将ReSi_(1.75)与Ru合金化后,形成一种剪切型微结构,其中两个相邻的畴在1101的矢量上相互对(101)进行剪切(移动),以增加Si的空位浓度,出现。 (4)ReSi_(1.75)的热电性质是高度各向异性的。电阻率的值始终大于。当测量时,其导电性为n型,而当测量时,其导电性为p型。由于其相当复杂的晶体结构,这种各向异性可能来自电子结构中的各向异性,也可能来自复杂的微观结构。 (5)尽管沿塞贝克系数的值适中较高(150-200μV/ K),但沿(250-300μV/ K)则很高。导热率的值是各向同性的并且相当小。结果,沿着1073 K进行测量时,可以实现0.7的非常高的无量纲品质因数(ZT)值。 ZT值进一步增加到0.8,添加少量Mo(Re的2%替代)。

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