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FUTURE DIRECTIONS OF NON-VOLATILE MEMORY TECHNOLOGIES

机译:非易失性存储技术的未来发展方向

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It expected that for many years to come, the majority of the nonvolatile memories shipped will be based on current mainstream flash technologies, which utilize transistor based charge storage memory cells and multi-level-cell concepts, for storing more than one logic bit in a single physical cell. Moore's law will continue to drive transistor based memory technology scaling but technology complexity will be increasing. In order to meet technology scaling, the mainstream transistor based flash technologies will start evolving to incorporate material and structural innovations. This paper will review the current status and discuss the approaches being explored to provide scaling solutions for future transistor based non-volatile memory products. Based on the introduction of material innovations, it is expected that the planar transistor based flash memory cell can scale into the 32nm node. Further, more complex, structural innovations will be required to maintain further scaling. New memory concepts, not relying on transistors as a basis of the memory cell, provide new opportunities for future low cost memories. Several of these new concepts will be summarized and contrasted with the mainstream transistor based flash memory technologies.
机译:预计在未来的很多年中,大多数非易失性存储器将基于当前主流的闪存技术,该技术利用基于晶体管的电荷存储存储器单元和多级单元概念,在一个存储器中存储多个逻辑位。单个物理单元。摩尔定律将继续推动基于晶体管的存储技术的发展,但是技术的复杂性将会增加。为了满足技术的发展,主流的基于晶体管的闪存技术将开始发展,以融合材料和结构上的创新。本文将回顾当前的状态,并讨论正在探索的方法,以为未来基于晶体管的非易失性存储器产品提供缩放解决方案。基于材料创新的介绍,预计基于平面晶体管的闪存单元可以扩展到32nm节点。此外,将需要更复杂的结构创新来保持进一步的规模。不依赖于晶体管作为存储单元基础的新存储概念为未来的低成本存储提供了新的机会。这些新概念中的几个将被总结,并与基于主流晶体管的闪存技术形成对比。

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