ELECTROPHORETIC AND ELECTROLYTIC DEPOSITION OF CERAMIC FILMS

摘要

Two electrodeposition processes have been utilized for forming ceramic coatings: electrophoretic deposition (EPD) and electrolytic deposition (ELD). ELD enables formation of nanostructured thin films. EPD is an important tool for preparation of thick ceramic films and body shaping. The feasibility of electrolytic deposition of various ceramic materials has been demonstrated. It was shown that chemical problems related to ELD of some important ceramic materials could be solved by use of specific precursors. An important finding was the possibility of electrochemical intercalation of cationic polyelectrolytes with inherent binding properties into ELD deposits. Advanced solvent-binder-dispersant systems were developed for deposition of consecutive ceramic layers of controlled thickness in multilayer EPD processing. Thin and thick films were deposited as monolayers or laminates on various substrates, including metals, conducting ceramics, carbon fibers and mats, platinized silicon wafers. The results presented involve the examination of the microstructure, composition and crystallization behavior of the deposits. Deposition yield was evaluated under various experimental conditions. Mechanisms of EPD and ELD, new developments and applications of the two methods are discussed.