首页> 外文会议>Sustainable Systems and Technology, 2009. ISSST '09 >Lead-free soldering of telecommunication network infrastructure products
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Lead-free soldering of telecommunication network infrastructure products

机译:电信网络基础设施产品的无铅焊接

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Ericsson has successfully transferred to lead-free solder for its high volume telecom network infrastructure products. By implementing measures for lead-free soldering in all stages of the product development process, from design and component selection to the production process, reliable products are ensured. As the high volume consumer electronic products are driving the components market towards lead-free soldering, the availability of components and materials are better for lead-free than for leaded soldering. Components can be obtained from approved sources, which is the basis for quality assurance and reduces the potential problems with counterfeit components. Lead-free conversion has also reduced the number of Last Time Buy (LTB) cases affecting Ericsson.
机译:爱立信已成功将其大容量电信网络基础设施产品转移到无铅焊料中。通过在产品开发过程的所有阶段(从设计和组件选择到生产过程)实施无铅焊接措施,可以确保可靠的产品。随着大量消费类电子产品推动组件市场走向无铅焊接,与无铅焊接相比,无铅组件和材料的可用性更好。组件可从经过批准的来源获得,这是质量保证的基础,并减少了假冒组件的潜在问题。无铅转换还减少了影响爱立信的上一次购买(LTB)案件的数量。

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