首页> 外文会议>STLE/ASME Joint International Tribology Conference and Exhibition; Oct 27-29, 2003; Ponte Vedra Beach, Florida >NANOSCALE HEAT TRANSFER MODELING IN SOLIDS: DATA STORAGE AND ELECTRONIC DEVICES
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NANOSCALE HEAT TRANSFER MODELING IN SOLIDS: DATA STORAGE AND ELECTRONIC DEVICES

机译:固体中的纳米尺度传热建模:数据存储和电子设备

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Lattice Boltzmann method (LBM), is used to examine multi-length scale, confined heat conduction phenomena in solids for which sub-continuum regime is important. This paper describes the implementation of the method and its application to cases pertinent to data storage and electronic devices. Thin solid films with internal heat generation and with temperature difference across the boundaries are used as case studies to illustrate the benefits of the LBM. We compare our results with various hierarchical equations of heat transfer such as Fourier, Cattaneo, and Boltzmann transport equations, as well as with experimental and numerical data from the literature. Our results exhibit a good agreement with other methodologies in one and two dimensions, at a much lower computational effort.
机译:格子Boltzmann方法(LBM)用于检查固体中的多长度尺度,局限的热传导现象,对于该现象而言,连续谱法很重要。本文介绍了该方法的实现及其在与数据存储和电子设备有关的案例中的应用。作为案例研究,使用内部产生热量且边界温度差的固体薄膜来说明LBM的优势。我们将我们的结果与各种传热分层方程式(例如,傅立叶,Cattaneo和Boltzmann传输方程式)以及文献中的实验数据和数值数据进行比较。我们的结果与其他方法在一维和二维上显示出很好的一致性,而所需的计算量却少得多。

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