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Effect of Current Density on Pore Formation in n-InP in KOH

机译:电流密度对KOH中n-InP孔形成的影响

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摘要

InP samples which were galvanostatically anodised in 5 mol dm~(-3) KOH exhibited crystallographic pore etching at current densities ranging from 1 mA cm~(-2) to 20 mA cm~(-2). Surprisingly, the total charge at growth termination (~1.8 C cm~(-2)) and the corresponding layer thickness (~3.0 μm) were independent of current density in experiments at continuous constant current. Surface pit density was proportional to current density, indicating that the average current per pit was 1.7 pA, independent of current density. The influence of mass transport on the termination of porous layer growth was demonstrated in an experiment at low current density where the current was interrupted a number of times before layer growth ended. At low current densities, pores had sharp tips, triangular cross-sections and large pore widths. At higher current densities, both the pore tips and the pore cross-sections became more rounded while the pore width decreased. These variations are explained in terms of the effect that different rates of hole supply (at different current densities) can have on the rate of indium vacancy formation on the three {111}A faces that make up the pore tip.
机译:在5 mol dm〜(-3)KOH中进行恒电流阳极化处理的InP样品在1 mA cm〜(-2)到20 mA cm〜(-2)的电流密度下表现出晶体学孔蚀。令人惊讶的是,在连续恒定电流下的实验中,生长终止时的总电荷(〜1.8 C cm〜(-2))和相应的层厚度(〜3.0μm)与电流密度无关。表面凹坑密度与电流密度成正比,表明每个凹坑的平均电流为1.7 pA,与电流密度无关。在低电流密度的实验中证明了质量传输对多孔层生长终止的影响,该实验在层生长结束之前中断了多次电流。在低电流密度下,孔隙具有尖锐的尖端,三角形横截面和较大的孔隙宽度。在较高的电流密度下,细孔尖端和细孔横截面都变得更圆,而细孔宽度减小。这些变化是根据不同的空穴供应速率(在不同的电流密度下)对构成孔尖端的三个{111} A面上铟空位形成速率的影响来解释的。

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