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Abnormal Dynamic Grain Growth During Creep Deformation ofPowder-Metallurgy (PM) Grade Molybdenum Sheet

机译:粉末冶金(PM)级钼薄板蠕变变形过程中动态晶粒的异常生长

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摘要

Commercial-purity, powder-metallurgy grade molybdenum sheet was subjected to tensile testing at slow strain rates, less than 1×10 -3 per second, and temperatures between 1300℃ and 1700℃. Above 1500℃, abnormal dynamic grain growth resulted after accumulation of a critical strain. Creep tests were performed under two conditions: constant-temperature strain-rate-change (SRC) tests over strain rates from 1×10 -6 to 5×10 -4 per second, and constant-temperature elongation-to-failure (EF) tests within this range. Data from these tests are used to characterize abnormal dynamic grain growth and its effect on creep deformation behavior of molybdenum. The molybdenum test coupons that underwent abnormal dynamic grain growth exhibited markedly different surface deformations and microstructures than the couponsrnthat did not. Mechanisms for the abnormal grain growth and for the causes of the differences in behavior as a function of temperature are discussed.
机译:商业纯度粉末冶金级钼片材以慢应变速率(小于每秒1×10 -3)和1300℃至1700℃的温度进行拉伸测试。 1500℃以上,临界应变积累后,导致晶粒动态生长异常。蠕变测试是在两种条件下进行的:在每秒1×10 -6到5×10 -4的应变速率下进行恒温应变率变化(SRC)测试,以及在温度范围内进行破坏的恒温伸长率(EF)在此范围内进行测试。这些测试的数据用于表征异常动态晶粒生长及其对钼蠕变变形行为的影响。经历异常动态晶粒生长的钼测试试样与没有试样的试样相比,表面变形和微观结构明显不同。讨论了异常晶粒生长的机理以及行为随温度变化的原因。

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  • 来源
  • 会议地点 San Diego CA(US);San Diego CA(US)
  • 作者

    J. Ciulik; E. M. Taleff;

  • 作者单位

    The University of Texas at AustinrnDepartment of Mechanical Engineeringrn1 University Station, C2200rnAustin, Texas 78712;

    The University of Texas at AustinrnDepartment of Mechanical Engineeringrn1 University Station, C2200rnAustin, Texas 78712rnTel: (512) 471-5378, Fax: (512) 471-7681, Email: taleff@mail.utexas.edu;

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