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Abnormal Dynamic Grain Growth During Creep Deformation of Powder-Metallurgy (PM) Grade Molybdenum Sheet

机译:粉末冶金(PM)级钼板蠕变变形期间异常动态晶粒生长

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Commercial-purity, powder-metallurgy grade molybdenum sheet was subjected to tensile testing at slow strain rates, less than 1×10 -3 per second, and temperatures between 1300°C and 1700°C. Above 1500°C, abnormal dynamic grain growth resulted after accumulation of a critical strain. Creep tests were performed under two conditions: constant-temperature strain-rate-change (SRC) tests over strain rates from 1×10 -6 to 5×10 -4 per second, and constant-temperature elongation-to-failure (EF) tests within this range. Data from these tests are used to characterize abnormal dynamic grain growth and its effect on creep deformation behavior of molybdenum. The molybdenum test coupons that underwent abnormal dynamic grain growth exhibited markedly different surface deformations and microstructures than the coupons that did not. Mechanisms for the abnormal grain growth and for the causes of the differences in behavior as a function of temperature are discussed.
机译:商业纯度,粉末冶金级钼板以慢应变率,小于1×10 -3每秒小于1×10 -3,温度在1300℃和1700℃之间。高于1500℃,临界应变累积后异常动态晶粒生长导致。在两个条件下进行蠕变试验:恒温应变率 - 变化(SRC)在恒定速率从1×10 -6至5×10 -4的恒定速率测试,恒温伸长率与失效(EF)在此范围内测试。来自这些测试的数据用于表征异常动态晶粒生长及其对钼蠕变变形行为的影响。接受异常动态晶粒生长的钼测试券表现出显着不同的表面变形和微观结构比没有的优惠券。讨论了异常晶粒生长的机制以及作为温度函数的行为差异的原因。

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