USING DYNAMIC MECHANICAL ANALYSES TO PROBE THE GLASSY STATE RESPONSE OF A Sub-Tg ANNEALED MODEL EPOXY NETWORK

摘要

Using dynamic mechanical analyzers the relaxation behavior of a loosely cross-linked model epoxy resin was investigated before and after room temperature aging. Preliminary results indicate a stiffening of the storage moduli occurs below -50℃, the β relaxation temperature of the epoxy network, with a subsequent softening of the network above room temperature and a drop in theapparent glass transition temperature (T_g ). Of the material with aging.