首页> 外文会议>Society of Plastics Engineers 61st Annual Technical Conference (ANTEC 2003) Vol.2 Materials May 4-8, 2003 Nashville, Tennessee >The effect of shear-induced migration of conductive fillers on conductivity of injection molded articles
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The effect of shear-induced migration of conductive fillers on conductivity of injection molded articles

机译:剪切诱导的导电填料迁移对注塑制品导电性的影响

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Conductive filler particles tend to migrate in non-uniform shear fields such as during mold filling from the regions of high shear stress to low shear stress leading to the loss of conductivity in polymeric articles. In this work, the effect of conductive filler migration on surface and volume conductivity was investigated in conductive compounds of polystyrene and polypropylene and carbon black. Injection molded articles with mean particle concentration of φ_c and 3.5φ_c where φ_c is the percolation threshold, showed volume conductivity values of respectively 10~(-18) and 10~(-4) S-cm, while compression molded specimens with same composition offered volume conductivity of 10~(-4) S-cm. Removal of surface layers from injection molded specimens by excimer laser ablation technique restored the conductivity to 10~(-4) S-cm. The extent of migration was evaluated in terms of the thickness of polymer layers removed from the surface, which depended on the type of polymer used.
机译:导电填料颗粒倾向于在不均匀的剪切场中迁移,例如在模具填充期间,从高剪切应力的区域迁移到低剪切应力的区域,从而导致聚合物制品中导电性的损失。在这项工作中,研究了聚苯乙烯和聚丙烯以及炭黑的导电化合物中导电填料迁移对表面和体积导电率的影响。平均颗粒浓度为φ_c和3.5φ_c(其中φ_c为渗透阈值)的注塑制品显示的体积电导率值分别为10〜(-18)和10〜(-4)S-cm,同时提供具有相同成分的压塑样品体积电导率为10〜(-4)S-cm。通过准分子激光烧蚀技术从注塑样品中去除表面层,使电导率恢复到10〜(-4)S-cm。根据从表面去除的聚合物层的厚度来评估迁移的程度,该厚度取决于所用聚合物的类型。

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