首页> 外国专利> THERMAL CONDUCTIVE RESIN COMPOSITION FOR LED LAMP HAVING EXCELLENT PHYSICAL STRENGTH AND INJECTION-MOLDABILITY, AND THERMAL CONDUCTIVITY AT THE SAME TIME, AND AN INJECTION MOLDED PRODUCTS USING THE SAME

THERMAL CONDUCTIVE RESIN COMPOSITION FOR LED LAMP HAVING EXCELLENT PHYSICAL STRENGTH AND INJECTION-MOLDABILITY, AND THERMAL CONDUCTIVITY AT THE SAME TIME, AND AN INJECTION MOLDED PRODUCTS USING THE SAME

机译:具有出色的物理强度和注射成型性的LED灯导热树脂组合物,以及在同一时间的导热性,以及使用相同的注射成型产品

摘要

PURPOSE: A thermal conductive resin composition is provided to dissipate heat generated from LED device to outside quickly, to have excellent injection moldability thereby manufacturing various shapes, and to have excellent physical strength.;CONSTITUTION: A thermal conductive resin composition comprises 10-30 weight% of thermoplastic resin, and 70-90 weight% of expanded graphite powder. A nylon resin is applied to the thermoplastic resin. The expanded graphite powder is obtained by expanding the volume of graphite 100-500 times in which impurities are removed through heat-treatment at 1000-1500 °C for 10-60 sec and crushing the graphite.;COPYRIGHT KIPO 2012
机译:用途:提供一种导热树脂组合物,以将LED器件产生的热量快速散发到外部,具有优异的注塑成型性,从而制造出各种形状,并具有出色的物理强度。;组成:导热树脂组合物包含10-30重量% %的热塑性树脂,和70-90%重量的膨胀石墨粉末。将尼龙树脂施加到热塑性树脂上。膨胀的石墨粉末是通过将石墨的体积膨胀100-500倍而获得的,其中通过在1000-1500℃下热处理10-60秒并除去石墨将杂质除去。; COPYRIGHT KIPO 2012

著录项

  • 公开/公告号KR20120032597A

    专利类型

  • 公开/公告日2012-04-06

    原文格式PDF

  • 申请/专利权人 STS TECHNOLOGY CO. LTD.;

    申请/专利号KR20100094011

  • 发明设计人 LEE DUK KIE;

    申请日2010-09-29

  • 分类号C08L77/02;C08K3/04;B29C45/00;C01B31/04;

  • 国家 KR

  • 入库时间 2022-08-21 17:10:21

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