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INVESTIGATION OF ELECTRON BEAM CURING OF BISMALEIMIDE (BMI) AND BMI/NVP RESINS

机译:联苯丙二酰亚胺(BMI)和BMI / NVP树脂的电子束引发研究

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摘要

Electron beam curing of a 4,4'-Bismaleimidodiphenyl-methane (BMPM) / BMI-1,3-tolyl / o,o'-diallylbisphenol A (DABPA) based BMI system, and the mixture of the above BMI resin with N-vinylpyrrolidone (NVP) is investigated to build the relationship of temperature rise, dosage and dosage rate and corresponding cure extents. The cure kinetics and effect of initiator on cure reactions are also carried out. Low intensity E-beam exposure cannot initiate BMI polymerization but high intensity E-beam exposure gives high reaction yield due to high temperature rise, which induced thermal curing. However, BMI/NVP systems can be initiated easily by low intensity E-beam exposure without thermal curing being induced. According to FT-IR measurements, 70% reaction conversion of BMI/NVP can be achieved by 200 kGy dosage exposure at 10 kGy per pass with the temperature rise no more than 50℃. The product having a T_g of 180℃ can be obtained.
机译:电子束固化基于BMI的4,4'-Bismaleimidodiphenyl-methane(BMPM)/ BMI-1,3-tolyl / o,o'-diallylbisphenol A(DABPA)以及上述BMI树脂与N-的混合物对乙烯基吡咯烷酮(NVP)进行了研究,以建立温度升高,剂量和剂量率与相应固化程度之间的关系。还进行了固化动力学和引发剂对固化反应的影响。低强度电子束暴露不能引发BMI聚合,但是高强度电子束暴露由于温度升高而产生高反应产率,从而引起热固化。但是,BMI / NVP系统可以通过低强度电子束曝光轻松启动,而不会引起热固化。根据FT-IR测量,在不超过50℃的温度下,以200 kGy的剂量暴露于10 kGy的每次通行中,可以达到70%的BMI / NVP反应转化率。可以得到T_g为180℃的产物。

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