Temperature constrained power management scheme for 3D MPSoC

摘要

This paper proposes a new temperature constrained power management scheme for 3D MPSoCs that utilizes instantaneous temperature monitoring along with information on the physical structure of the stack to determine operating V-F levels for processing elements (PE). The scheme implements a weighted policy that prevents PEs deep inside the stack from being turned off, maintains operating temperatures stable and within safe margins, and reduces overall execution time by up to 19.55%.