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Advantages of Integrated InSb Hall Sensors with a GaAs HBT Signal Processing Circuit

机译:具有GaAs HBT信号处理电路的集成InSb霍尔传感器的优势

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Monolithically integrating indium antimonide (InSb) magnetic sensors with heterojunction bipolar transistor (HBT) signal conditioning circuits enables magnetic sensor designs with improved levels of performance. As a first step, the HBT epitaxy is deposited on gallium arsenide (GaAs) substrates. Subsequently, the InSb sensor material is deposited into etched wells. The resultant InSb sensor element(s) and HBT circuit are processed together. Compared to silicon (Si) Hall sensors, integrated compound semiconductor sensors provide; higher sensitivity, improved S/N ratio, greater robustness against ESD (using incorporated Zener diodes), no switching noise, and clean signals since signal processing is analog and not chopped.
机译:将锑化铟(InSb)磁性传感器与异质结双极晶体管(HBT)信号调理电路进行单片集成可实现性能提高的磁性传感器设计。第一步,将HBT外延沉积在砷化镓(GaAs)衬底上。随后,将InSb传感器材料沉积到蚀刻的阱中。最终的InSb传感器元件和HBT电路一起处理。与硅(Si)霍尔传感器相比,集成式化合物半导体传感器具有以下优势:由于信号处理是模拟的而不是斩波的,因此具有更高的灵敏度,更高的信噪比,对ESD的更高的鲁棒性(使用内置的齐纳二极管),无开关噪声以及干净的信号。

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