Direct Cu-on-Ta Electroplating From Ionic Liquids In High Vacuum

摘要

Due to their intrinsic ionic conductivity and wide electrochemical window, ionic liquids are interesting non-aqueous electrolytes for the electrodeposition of reactive metals which cannot be deposited from aqueous solutions (1-5). Studies have been made on the electrodeposition of titanium (6-7), tantalum (8-9), magnesium (10), silicon (11), germanium (12), cesium (13) and the rare earths (14), but the most successful and convincing results were obtained for aluminium and some of its alloys (15-26).