INFLUENCE OF A DUCTILE INTERLAYER ON THE TOUGHNESS OF HYDROPHILIC WAFER BONDING

机译：硬质合金夹层对亲水性晶圆键合韧性的影响

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In order to increase the toughness of the bonding, a thin metal layer is introduced near the interface created by wafer bonding. A theoretical study of the influence of this metal interlayer on the toughness of the bonding was undertaken.

机译：为了增加键合的韧性，在晶片键合所产生的界面附近引入了薄金属层。对这种金属中间层对粘结韧性的影响进行了理论研究。

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《Proceedings vol.2005-02; Electrochemical Society(ECS) 2005 Spring Meeting and International Symposium on Semiconductor Wafer Bonding VIII: Science, Technology, and Applications; 200505; Quebec City(CA)》|2005年|P.264-269|共6页
会议地点 Quebec City(CA)
作者
Y. Bertholet; J.P. Raskin; T. Pardoen;
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Research Centre in Micro and Nanoscopic Materials and Electronic Devices, Universite catholique de Louvain, Place du Levant 3, B-1348 Louvain-la-Neuve, Belgium;

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原文格式 PDF
正文语种 eng
中图分类材料;
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4. INFLUENCE OF A DUCTILE INTERLAYER ON THE TOUGHNESS OF HYDROPHILIC WAFER BONDING [C] . Y. Bertholet, J.P. Raskin, T. Pardoen Proceedings vol.2005-02; Electrochemical Society(ECS) 2005 Spring Meeting and International Symposium on Semiconductor Wafer Bonding VIII: Science, Technology, and Applications; 200505; Quebec City(CA) . 2005

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INFLUENCE OF A DUCTILE INTERLAYER ON THE TOUGHNESS OF HYDROPHILIC WAFER BONDING

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