COPPER ELECTRODEPOSITION ONTO TITANIUM AND OTHER SUBSTRATES: EFFECT OF BATH COMPOSITION

摘要

The impact of reactant and additive concentration on the electrochemical nucleation and growth of Cu onto Ti, Ta, and glassy carbon was studied using electrochemical methods and scanning electron microscopy. Furthermore, experimental results were compared with a numerical and several theoretical models.(1,2) SEM images show that the particle density increases with reactant concentration up to concentrations of approximately 50 mM. The influence of additive concentration on particle density was found to be important but relatively small.