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ELECTRICAL PROPERTIES OF B-DOPED POLYCRYSTALLINE Si_(1-x-y)Ge_xC_y FILM DEPOSITED BY ULTRACLEAN LOW-PRESSURE CVD

机译:超低气压CVD沉积的B掺杂多晶硅Si_(1-x-y)Ge_xC_y的电学性质

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摘要

The relationship between electrical properties of B-doped poly-Si_(1-x-y)Ge_xC_y and heat-treatment conditions has been investigated. Poly-Si_(1-x-y)Ge_xC_y films with average B concentration of, 1.5x10~(20) cm~(-3) were deposited on thermally oxidized Si(100) at 500-650 ℃ in a SiH_4-GeH_4-SiH_3CH_3-H_2 gas mixture by an ultraclean hot-wall low-pressure chemical vapor deposition, followed by ~(11)B~+ ion implantation and heat-treatment. The resistivity decreases with increasing Ge fraction and increases with increasing C fraction. Hall measurement and X-ray diffraction results suggest that the disordered regions near grain boundaries are reduced by the existence of Ge and density of the carrier traps at grain boundaries is increased by C segregation at grain boundaries. From the results of subsequent heat-treatment at lower temperature, it is also suggested that B segregation at grain boundaries is suppressed by the existence of C at grain boundaries.
机译:研究了掺B的多晶硅Si_(1-x-y)Ge_xC_y与热处理条件之间的关系。在SiH_4-GeH_4-SiH_3CH_3-中于500-650℃的热氧化Si(100)上沉积平均B浓度为1.5x10〜(20)cm〜(-3)的Poly-Si_(1-xy)Ge_xC_y膜。通过超净热壁低压化学气相沉积法沉积H_2气体混合物,然后进行〜(11)B〜+离子注入和热处理。电阻率随Ge分数的增加而降低,随C分数的增加而增加。霍尔测量和X射线衍射结果表明,Ge的存在降低了晶界附近的无序区域,晶界处的C偏析提高了晶界处载流子陷阱的密度。从随后在较低温度下进行热处理的结果,还表明,由于晶界中存在C,抑制了晶界中的B偏析。

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