首页> 外文会议>Proceedings of the Twenty-sixth annual meeting of the American Society for Precision Engineering >THROUGH-HOLE DRILLING OF SODA-LIME GLASS PLATE USING ELECTROPLATED DIAMOND TOOL
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THROUGH-HOLE DRILLING OF SODA-LIME GLASS PLATE USING ELECTROPLATED DIAMOND TOOL

机译:电镀金刚石工具对钠钙玻璃板的全孔钻削

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摘要

This paper investigated tool geometries and drilling conditions to minimize crack size when drilling soda-lime glass plate with a thickness of 2.8mm using electroplated diamond tool. The obtained results are as follows. The chip removal in the through-hole drilling is necessary in order to minimize crack size. In step drilling, the tool with chip pockets and bowl end is effective. In helical drilling, the tool with a space in drilling is effective. In each drilling method, the crack size increases with the drilling numbers. The thrust force rises owing to the adhered chip at the tool end. The small crack size is required to control the adhesive of chip. Therefore, the washing of tool is required in order to restrain crack. It can maintain the crack size of less than 0.1mm by removing chip adhered on the tool surface.
机译:本文研究了工具的几何形状和钻孔条件,以在使用电镀金刚石工具钻孔厚度为2.8mm的钠钙玻璃板时最大程度地减少裂纹尺寸。获得的结果如下。为了减小裂纹尺寸,必须在通孔钻孔中去除切屑。在分步钻孔中,带切屑腔和碗端的工具是有效的。在螺旋钻孔中,在钻孔中留出一定空间的工具是有效的。在每种钻孔方法中,裂纹尺寸随钻孔次数而增加。推力由于在工具端部处粘附的切屑而升高。需要小的裂缝尺寸来控制芯片的粘合剂。因此,为了抑制裂纹,需要清洗工具。通过去除附着在刀具表面的切屑,可以将裂纹尺寸保持在0.1mm以下。

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