首页> 外文会议>Proceedings of the Fourteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems >Enhanced performance of a thermal ground plane utilizing an Inorganic Aqueous Solution
【24h】

Enhanced performance of a thermal ground plane utilizing an Inorganic Aqueous Solution

机译:利用无机水溶液增强了热接地层的性能

获取原文
获取原文并翻译 | 示例

摘要

In this paper, two TGPs with monoporous sintered wick structures fabricated from spherical copper particles, are studied. The TGPs used in this study are 3″ by 5″ troughs, 4.8mm in depth, made of copper. On the back side of the trough, a 1cm2 raised section, referred to as pedestal, is used as a heater interface; pedestal is subjected to heat fluxes from 50 to 250 W/cm2 and the data is recorded when steady state is achieved at each heat flux.
机译:本文研究了两种由球形铜粒子制成的具有单孔烧结芯结构的TGP。本研究中使用的TGP为3英寸乘5英寸的深度为4.8mm的铜制槽。在水槽的背面,有一个1平方厘米的凸起部分(称为基座)用作加热器接口。基座承受的热通量为50至250 W / cm2,当每个热通量达到稳定状态时,记录数据。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号