THIN FILM FUSE LINK

摘要

The operating characteristics of a compact style of substrate fuse link will be presented. The fuse consisted of an alumina substrate with a combination of single layer screen printing and vapour deposited silver film that formed the element. The fuse link had a nominal current rating capacity of 63 Amps and was tested both at low and high overloads. In addition capacitor bank tests were also performed which tested the fuse link's ability to clear a DC short circuit. The new fuse links had a shorter operating time when compared with the conventional semiconductor fuse of similar rating. From the "captured" current-voltage characteristics, there is a sharp cutoff to the short circuit current with no overshoot which gives a more symmetrical current waveform. The largest performance gain is in the lowering of the I~2t let through when compared with a conventional fuse link. In general there was a factor of seven improvement when using a substrate fuse. However, for high overload currents, this improvement increased to a factor of 19. These results show that this type of fuse link demonstrates some clear advantages for the protection of sensitive semiconductor devices.