Material Characterisation of Adhesively Bonded Joints Under Static and Dynamic Loading by DMA

摘要

To determine mechanical properties of adhesively bonded joints with reasonable efforts a conventional Dynamic Mechanical Analyser (DMA) can be used.rnThe method uses the raw data of the load and displacement signal of the apparatus for analysis. The signals are acquired and evaluated by specially developed software programs. With consideration of machine related limitations, adapted test specimens allow the determination of quasi-static moduli as well as the study of the fatigue be-haviour of adhesively bonded joints under tensile and shear loading in a wide temperature range.