Future Materials Challenges

摘要

Continued silicon IC scaling, demand for greater functionality in wireless computing andrncommunication, and environmental initiatives are driving the development of thermosettingrnpolymers with tighter control and improved functionality. These trends are pushingrnrequirements for thermoset material properties to the edge of their capabilities and requiringrnoptimization of many properties simultaneously. Due to the complexity of the assembly,rnprocessing and use conditions, there is even greater need to characterize the thermal-mechanicalrnproperties through the assembly and operation in products. Since many of these materials will bernoperating close to their capability, there will be even more need to correlate physical propertiesrnto manufacturability, end-product performance and reliability and monitor the statisticalrndistribution of the properties. This will drive improvements in thermal characterizationrntechnology and methodology with improved accuracy and the ability to simultaneouslyrncharacterize multiple properties through process, assembly and use conditions.