Development of a Novel Highly Conductive Aluminum Particle based Filler for Low Density Conductive Composites

摘要

To provide a light weight filler material for low density conductive composites, a novel aluminum based system is being developed. A simple zincate solution of zinc oxide and caustic soda is used for coating the Al particles. The influence of various factors on this process, such as concentration, temperature, times, and additives, are reported. Additionally, the zinc/aluminum particles were coated with tin resulting in desirable low powder resistivity values comparable to copper particles.