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Contact Material Effects on Dynamic Contact Sticking

机译:触头材料对动态触头粘连的影响

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The dynamic welding behaviour at make operation is one important characteristic of electrical contacts and a key parameter to ensure secure usage of electricity. Model switch and device tests have been performed to work out the main factors influencing contact sticking. The behaviour of different silver metal oxides (Ag/CdO, Ag/SnO2, Ag/ZnO), including various groups of additives like low melting and boiling metal oxides (Bi2O3), and combinations thereof were studied under different loads. Two main working mechanisms - that significantly influence and define the sticking tendency - have been found for different arcing loads. They can be explained by metallurgical investigations and divided into mechanisms under low (below 0.3 Ws), medium (0.3 - 10 Ws), and high (above 10 Ws) arcing load. Low melting additives like Bi2O3 can effectively reduce weld strength at low and medium arcing energies by building up embrittling surface layers. This function is not given any more for high make arc energies or make operations on previous high energy break arcs, due to metal oxide depleted surface layers. Sublimating metal oxides (e.g. ZnO) leave bubbles within the microstructure and work better at high arcing energies. The paper presents a scientific basis to explain contact sticking failures under different types of loads and can be seen as a guideline for appropriate contact material selection.
机译:制造过程中的动态焊接行为是电触点的重要特征,也是确保安全用电的关键参数。已经进行了模型开关和设备测试,以找出影响触点粘连的主要因素。研究了不同银金属氧化物(Ag / CdO,Ag / SnO2,Ag / ZnO)的行为,包括不同组的添加剂,如低熔点和沸腾的金属氧化物(Bi2O3)及其组合在不同负载下的行为。对于不同的电弧负载,发现了两种主要的工作机制-显着影响和定义了粘附趋势。它们可以通过冶金研究来解释,并分为低(低于0.3 Ws),中等(0.3-10 Ws)和高(高于10 Ws)电弧负载下的机理。诸如Bi2O3之类的低熔点添加剂可通过建立脆化表面层来有效降低中,低电弧能量下的焊接强度。由于耗尽了金属氧化物的表面层,因此对于高接通电弧能量或在先前的高能量中断电弧上进行接通操作,不再提供此功能。升华的金属氧化物(例如ZnO)在微结构内留下气泡,并且在高电弧能量下效果更好。该论文为解释不同类型负载下的接触粘连故障提供了科学依据,并且可以被视为适当选择接触材料的指南。

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