首页> 外文会议>Proceedings of the 27th European solid-state device research conference >Enhanced Breakdown Voltage and Charge to Breakdown of Collector Implant-Gate Oxide-Poly Capacitors by Selective Epitaxial Growth
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Enhanced Breakdown Voltage and Charge to Breakdown of Collector Implant-Gate Oxide-Poly Capacitors by Selective Epitaxial Growth

机译:通过选择性外延生长增强的击穿电压和电荷,以击穿集电极-门极氧化物-多聚电容器

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摘要

Poly to collector implant capacitors can be realized in any BiCMOS technology without additional process and mask steps. They are therefore very attraactive elements for mixed signal BiCMOS processes. For thin gate oxides below 150A the poor quality of the oxide grown on the collector due to the implant damage leads to unacceptable defet densities(above 10 cm~(-2)). By applying a thin selective epitaxial growth on the collector areas the crystal quality can be recovered. The improved oxide quality is resulting in low defect densities (better 0.1cm~(-2)) and nearly doubled breakdown voltage for the same specific capacity per unit area in a 90A gate oxide 0.5 um gate length process. The charge to breakdown (QBD) is increased by a factor of 10.
机译:可以采用任何BiCMOS技术实现多晶硅到集电极植入电容器,而无需额外的工艺和掩模步骤。因此,它们对于混合信号BiCMOS工艺来说是非常缺乏吸引力的元素。对于低于150A的薄栅氧化物,由于注入损伤而在集电极上生长的氧化物质量较差,会导致不可接受的定义密度(大于10 cm〜(-2))。通过在集电极区域上进行薄的选择性外延生长,可以恢复晶体质量。改进的氧化物质量导致低缺陷密度(更好的0.1cm〜(-2))和在90A栅极氧化物0.5 um栅极长度工艺中每单位面积具有相同比容量时的击穿电压几乎翻倍。击穿电荷(QBD)增加了10倍。

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