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Strategic Allicances for highly efficient 300 mm Waferfabs

机译:高效300毫米晶圆厂的战略联盟

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State-of-the-Art waferfabs require a grwoing demand for integrated and highly efficient system solutions in terms of investment costs, running costs and yield improvement. It will be explained which factos are determinant to the profitability of a waferfab. Making the change from 200 mm to 300 mm wafers together with the jump to 0.25#mu#m technology will be the challenge the entire semiconductor industry within the coming years. The author explains why jump 300 mm is so critical in terms of technology and efficienty. The investment costs which are necessary to cope with the 300mm challenge are more than any sigle company can handle. This is why strategic alliances have to be founded. The impacts are obvious: systems or turnkey supplier to the semiconductor industry have to contribute as well as the chipmanufactuers to ease the burden of huge investment costs.
机译:在投资成本,运行成本和产量提高方面,最先进的晶圆厂对集成高效系统解决方案的需求不断增长。将解释哪些因素决定了晶圆厂的盈利能力。在未来几年中,将200 mm的晶圆转换为300 mm的晶圆,并跃升至0.25#mu#m技术将是整个半导体行业的挑战。作者解释了为什么跳动300 mm对于技术和效率如此重要。应对300mm挑战所必需的投资成本远远超过任何一家公司。这就是为什么必须建立战略联盟的原因。影响是显而易见的:半导体行业的系统或交钥匙供应商必须与芯片制造商一起做出贡献,以减轻巨额投资成本的负担。

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