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Strategic Allicances for highly efficient 300 mm Waferfabs

机译:高效300 mm晶圆厂的战略联盟

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State-of-the-Art waferfabs require a grwoing demand for integrated and highly efficient system solutions in terms of investment costs, running costs and yield improvement. It will be explained which factos are determinant to the profitability of a waferfab. Making the change from 200 mm to 300 mm wafers together with the jump to 0.25#mu#m technology will be the challenge the entire semiconductor industry within the coming years. The author explains why jump 300 mm is so critical in terms of technology and efficienty. The investment costs which are necessary to cope with the 300mm challenge are more than any sigle company can handle. This is why strategic alliances have to be founded. The impacts are obvious: systems or turnkey supplier to the semiconductor industry have to contribute as well as the chipmanufactuers to ease the burden of huge investment costs.
机译:最先进的Waferfabs需要在投资成本,运行成本和产量改进方面对集成和高效的系统解决方案进行Grwoing需求。 将解释哪些事实是对仿磨损率的盈利能力的决定因素。 使200毫米至300毫米晶圆的变化与跳跃到0.25#mu#M技术将成为未来几年内整个半导体行业的挑战。 作者解释了为什么在技术和高效的方面跳跃300毫米是如此至关重要。 应对300毫米挑战所必需的投资成本不仅仅是任何人都可以处理。 这就是为什么要成立战略联盟。 影响是显而易见的:半导体行业的系统或交钥匙供应商必须为芯片制造者提供贡献,以缓解巨额投资成本的负担。

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