首页> 外文会议>Proceedings of the 2011 ACM/SIGDA international symposium on field programmable gate arrays. >Architecture Description and Packing for Logic Blocks with Hierarchy, Modes and Complex Interconnect
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Architecture Description and Packing for Logic Blocks with Hierarchy, Modes and Complex Interconnect

机译:具有层次结构,模式和复杂互连的逻辑块的体系结构描述和打包

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The development of future FPGA fabrics with more sophisticated and complex logic blocks requires a new CAD flow that permits the expression of that complexity and the ability to synthesize to it. In this paper, we present a new logic block description language that can depict complex intra-block interconnect, hierarchy and modes of operation. These features are necessary to support modern and future FPGA complex soft logic blocks, memory and hard blocks. The key part of the CAD flow associated with this complexity is the packer, which takes the logical atomic pieces of the complex blocks and groups them into whole physical entities. We present an area-driven generic packing tool that can pack the logical atoms into any heterogeneous FPGA described in the new language, including many different kinds of soft and hard logic blocks. We gauge its area quality by comparing the results achieved with a lower bound on the number of blocks required, and then illustrate its explorative capability in two ways: on fracturable LUT soft logic architectures, and on hard block memory architectures. The new infrastructure attaches to a flow that begins with a Verilog front-end, permitting the use of benchmarks that are significantly larger than the usual ones, and can target heterogenous FPGAs.
机译:未来具有更复杂,更复杂的逻辑模块的FPGA架构的开发需要新的CAD流程,该流程可以表达这种复杂性并具有对其进行综合的能力。在本文中,我们提出了一种新的逻辑块描述语言,该语言可以描述复杂的块内互连,层次结构和操作模式。这些功能对于支持现代和未来的FPGA复杂的软逻辑块,存储器和硬块是必需的。与这种复杂性相关联的CAD流程的关键部分是打包器,该打包器将复杂块的逻辑原子片段组合成整个物理实体。我们提供了一种区域驱动的通用打包工具,该工具可以将逻辑原子打包到以新语言描述的任何异构FPGA中,包括许多不同种类的软和硬逻辑块。我们通过比较所获得的结果与所需块数的下限来衡量其区域质量,然后以两种方式说明其探索能力:可碎LUT软逻辑体系结构和硬块存储器体系结构。新的基础架构附加到以Verilog前端开始的流程,从而允许使用比常规基准大得多的基准,并且可以针对异构FPGA。

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