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A Specification Methodology for the Optimal Layout of a 2-Stage Interconnect Bus for Massively Parallel Architectures

机译:大规模并行架构的两阶段互连总线最佳布局的规范方法学

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The upcoming technology of Field Programmable Gate Arrays is now reaching applications in the domain of High-Performance Computing. Due to this fact computer architecture becomes more and more diverse, up to parallel architectures consisting entirely of FPGAs as processing elements. Depending on the design approach some of these custom computing machines require a custom interconnect bus. Here the 2-stage shared bus is of great importance due to the structural similarity to the common mechanical connection and mounting concept of cards which are plugged into a backplane. The performance of this bus depends on both, the logical design and the Printed-Circuit-Board layout specification. Critical parameters are identified and a methodology is shown how to optimize a 2-stage interconnect bus in terms of specifying the PCB-layout. Finally an implementation is presented where this methodology has been applied.
机译:即将到来的现场可编程门阵列技术正在高性能计算领域得到应用。由于这个事实,计算机体系结构变得越来越多样化,直至完全由FPGA组成的并行体系结构作为处理元素。根据设计方法,其中一些定制计算机器需要定制互连总线。在这里,两级共享总线非常重要,因为其结构与插入底板的普通卡的机械连接和安装概念相似。该总线的性能取决于逻辑设计和印刷电路板布局规范。确定了关键参数,并展示了一种方法,该方法根据指定的PCB布局来优化2级互连总线。最后,介绍了一种应用了该方法的实现方式。

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