Investigations of Epoxy Moulding Structure for IGBT Module

摘要

New epoxy moulding and thick copper foil DCB substrate structure for IGBT module without copper base was investigated. For the low cost and the low thermal resistance, new thick copper foil and alumina oxide with zirconia (Zr) DCB is adopted. For the high reliability, new epoxy resin with low Coefficient of Thermal Expansion (CTE) and good adhesion capability, and new lead free solder are adopted. Using these new technologies, our Epoxy Moulding structure IGBT module shows excellent thermal and mechanical characteristics.