首页> 外文会议>Powder Metallurgy World Congress amp; Exhibition(PM 2006); 20060924-28; Busan(KR) >Tungsten/Copper Functionally Graded Materials: Possible Applications and Processing through the Powder Metallurgy Route
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Tungsten/Copper Functionally Graded Materials: Possible Applications and Processing through the Powder Metallurgy Route

机译:钨/铜功能分级材料:粉末冶金路线的可能应用和加工

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摘要

Processing of W-Cu graded materials from attritor-milled W-CuO mixtures is described. The powder reduction steps are investigated by TG and XRD analyses and by microstructural observations (SEM, TEM). Sintering of reduced powder with different compositions is analysed by dilatometry. Sintering behaviour of the graded component processed by co-compaction of a 10/20/30wt%Cu multi-layer material is briefly discussed. Liquid Cu migration is observed and smoothes the composition gradient. Perspectives to control this migration are discussed.
机译:描述了从磨碎的W-CuO混合物加工W-Cu分级材料。通过TG和XRD分析以及微观结构观察(SEM,TEM)研究了粉末还原步骤。通过膨胀法分析具有不同组成的还原粉末的烧结。简要讨论了通过共压制10/20 / 30wt%Cu多层材料处理的梯度成分的烧结行为。观察到液态铜迁移并且使组成梯度平滑。讨论了控制这种迁移的观点。

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