首页> 外文会议>Powder Metallurgy World Congress amp; Exhibition(PM 2006); 20060924-28; Busan(KR) >Non-Electrolytic Deposition of Silver on Tungsten Powders for Functionally Gradient Composite Powder
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Non-Electrolytic Deposition of Silver on Tungsten Powders for Functionally Gradient Composite Powder

机译:功能梯度复合粉末在钨粉上的非电解沉积银

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The research conducted was focused primarily on the development of a process for obtaining silver-coated tungsten powders for applications related to electrical-conducting devices. Particles of high strength material when coated with silver offer a means of obtaining desirable electrical properties and high strength. The coating process employed aqueous ammoniacal silver-nitrate electrolytes with a formaldehyde solution as the reductant. Modifying additives were also applied. The reduction and subsequent deposition of silver occurred selectively on the surface of the tungsten particles. The morphologies of the coated particles were assessed by SEM imaging. The silver was uniformed coated on tungsten powder and its thickness was estimated to be approximately 100nm on the basis of a mass account.
机译:进行的研究主要集中在开发用于与导电设备相关的应用中的涂银钨粉的方法的开发。当高强度材料的颗粒涂有银时,它提供了一种获得所需电性能和高强度的方法。涂覆工艺使用氨水硝酸银水溶液,其中甲醛溶液作为还原剂。还应用了改性添加剂。银的还原和随后的沉积选择性地发生在钨颗粒的表面上。通过SEM成像评估涂覆颗粒的形态。将银均匀地涂覆在钨粉上,并且基于质量考虑,其厚度估计为约100nm。

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