Thermal Management Application of Nano Tungsten-Copper Composite Powder

摘要

Heat dissipation technology is a critical element in nearly all new chip generations, in high power LED and high temperature hybrid automotive. A heat sink or heat spreader, mounted on a base plate, requires the use of special materials possessing both high thermal conductivity (TC) and a coefficient of thermal expansion (CTE) matching semiconductor materials. In this study, nano tungsten coated copper powder has been developed with a range of compositions from 85W-15Cu to 20W-80Cu in weight percentage. Die compaction was used to make samples to evaluate TC and CTE as a function of density for two compositions of tungsten coated copper powder. The measured TC lies among theoretical values predicted by a new model that considers grain size effects.