Unique Transparent Resin and Vacuum Printing Encapsulation Systems (VPES) Packaging Method for New White LED

机译：新型白光LED的独特透明树脂和真空印刷封装系统（VPES）封装方法

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As you know, LED (light emitting diode) industry is full of vigor. They are used by signal, car, and backlight of mobile telephone and so on. In particular, white color LED attracts attention very much, If it is applied to lighting equipments in future, i

机译：众所周知，LED（发光二极管）行业充满生机。它们被信号，汽车和手机的背光灯等使用。尤其是白色LED引起了极大的关注，如果将来将其应用于照明设备，

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来源
《Polmyers and Adhesives in Microelectronics and Photonics, Polytronic 2007 - 6th International Conference on》|2007年|P.81-86|共6页
会议地点 TokyoJapan
作者
Miyawaki; Y.; Dongxu Wang; Tanaka; O.; Ooyama; N.; Okuno; A.;
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electronics packaging; encapsulation; light emitting diodes; reliability; resins; PCB material; VPES; epoxy resin; high density packaging technology; humidity test; transparent resin; vacuum printing encapsulation systems packaging; white LED; white light emitting di;

机译：电子包装；封装发光二极管;可靠性;树脂; PCB材料； VPES；环氧树脂高密度包装技术；湿度测试；透明树脂；真空印刷封装系统包装；白光LED；白色发光二极管;

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1. High reliability, high density, low cost packaging systems for matrix systems for matrix BGA and CSP by vacuum printing encapsulation systems (VPES) [J] . Okuno A., Fujita N. IEEE Transactions on Advanced Packaging . 1999,第3期

机译：用于矩阵BGA和CSP的矩阵系统的高可靠性，高密度，低成本包装系统，通过真空印刷封装系统（VPES）
2. Effect of UV curing on electrical properties of a UV-Curable co-Polyacrylate/Silica nanocomposite as a transparent encapsulation resin for device packaging [J] . Wang YY, Hsieh TE Macromolecular chemistry and physics . 2007,第22期

机译：紫外线固化对紫外线固化的共聚丙烯酸酯/二氧化硅纳米复合材料作为器件封装的透明封装树脂的电性能的影响
3. Characteristics of transparent encapsulation materials for OLEDs prepared from mesoporous silica nanoparticle-polyurethane acrylate resin composites [J] . Park Jung Hyuk, Baek Sung-Doo, Cho Jin Il, Composites . 2019,第OCTa15期

机译：由介孔二氧化硅纳米粒子-聚氨酯丙烯酸酯树脂复合材料制备的OLED透明封装材料的特性
4. Unique Transparent Resin and Vacuum Printing Encapsulation Systems (VPES) Packaging Method for New White LED [C] . Miyawaki, Yoshiteru, Wang, . 2007

机译：新型白光LED的独特透明树脂和真空印刷封装系统（VPES）封装方法
5. Fabrication of Glass Fiber-Reinforced Transparent Composites Using Vacuum Assisted Resin Transfer Molding Process [D] . Taylor, Gregory. 2014

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7. New LED Package by Vacuum Printing Encapsulation Systems and High Reliability Transparent Liquid Type Epoxy Resin [O] . Atsushi OKUNO, Noritaka OYAMA, Yoshiteru MIYAWAKI 2003

机译：新LED封装通过真空印刷封装系统和高可靠性透明液体型环氧树脂

Unique Transparent Resin and Vacuum Printing Encapsulation Systems (VPES) Packaging Method for New White LED

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