Laser material processing in microelectronics manufacturing: status and near-term opportunities

摘要

Lasers continue to gain ground in materials processing applications for microelectronics manufacturing. Printed circuit boards, IC wafers, substrates for blue/green LEDs, and various components in flat panel displays are all being processed with lasers. Some of these operations, such as microvia drilling in high-density circuit boards, are well established; others are under evaluation or in early stages of development. This paper summarizes the status of a number of key applications that currently or potentially add value to the complex manufacturing processes for state-of-the-art microelectronic devices. Particular attention is paid to flat panel display manufacturing, where the worldwide mass-production ramp currently underway is demanding innovative techniques that provide the speed, quality, or flexibility needed to reduce manufacturing costs.