Laser material processing in microelectronics manufacturing: status and near-term opportunities

摘要

Lasers continue to gain ground in materials processing applications for microelectronics manufacturing. Printed circuitboards, IC wafers, substrates for blue/green LEDs, and various components in flat panel displays are all being processedwith lasers. Some of these operations, such as microvia drilling in high-density circuit boards, are well established;others are under evaluation or in early stages of development. This paper summarizes the status of a number of keyapplications that currently or potentially add value to the complex manufacturing processes for state-of-the-artmicroelectronic devices. Particular attention is paid to flat panel display manufacturing, where the worldwide massproductionramp currently underway is demanding innovative techniques that provide the speed, quality, or flexibilityneeded to reduce manufacturing costs.