首页> 外文会议>The Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference amp; Exhibition Jul 8-13, 2001, Kauai, Hawaii >A NEW METHOD FOR DRILLING SMALLER THROUGH-HOLES IN PRINTED WIRING BOARDS USING A DIAMOND COATED DRILL
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A NEW METHOD FOR DRILLING SMALLER THROUGH-HOLES IN PRINTED WIRING BOARDS USING A DIAMOND COATED DRILL

机译:用金刚石涂层钻头在印刷线路板上钻通小孔的新方法

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摘要

In the present report, we propose a new method for drilling smaller though-holes in printed wiring boards. First, it was shown that diamond coated drill could drill more than 6 times the number of holes than a conventional drill made of cemented carbide. Second, we evaluated the resin smear on the hole wall, the surface roughness in the hole wall, the internal damage around the hole and the deflection of the hole in terms of FR-4 type printed wiring boards production. It was confirmed that the hole quality drilled with the new drill tool is sufficient from the above results.
机译:在本报告中,我们提出了一种在印刷线路板上钻较小通孔的新方法。首先,研究表明,金刚石涂层钻头的钻孔数量是传统硬质合金钻头的6倍以上。其次,就FR-4型印刷线路板的生产而言,我们评估了树脂在孔壁上的污迹,孔壁的表面粗糙度,孔周围的内部损伤以及孔的挠度。从以上结果可以证实,使用新的钻具钻出的孔质量是足够的。

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