NUMERICAL STUDY ON PLATE TYPE HEAT SPREADER

摘要

Numerical solutions are presented for heat transfer in a plate type heat spreader. The simulation deals with a steady state two-dimensional heat conduction problem for the four-and two-layer circular plates systems, which correspond to the simplified models for the [chip] - [thermal interface material A] - [heat spreader] - [thermal interface material B] system, and the [chip] - [thermal interface material] system without a heat spreader for comparison. A localized heat source of uniform heat flux is flush mounted on the bottom surface of the chip, and the top surface of the chip (two-layer system) or the heat spreader (four-layer system) is in contact with a heat sink of uniform temperature through the thermal interface material. From a series of numerical calculations, the effects of the thickness and the thermal conductivity of the heat spreader, and the size of the localized heat source and the chip on the maximum chip temperature are clarified. Especially, the following interesting results are obtained from the present study. That is, an apt combination of the thermal interface materials A and B is essential to make the heat spreader fulfill its intended function, and in addition the heat spreader has the optimum thickness, which minimizes the maximum chip temperature.