Loop Thermosyphons and Their Applications to High Density Electronics Cooling

摘要

Recent innovations to thermosyphon designs and their applications to electronics cooling will have a significant impact on electronics cooling solutions. Future electronics systems including high-density desktop computers, thin multi-processor rack mounted servers, and telecommunications cabinets will reach volumetric thermal densities beyond the limits of conventional air-cooling. Alternative cooling solutions need to be developed. The power dissipation of microprocessors has reached 100 W. Furthermore the power density, at the chip level, is approaching 100 W/cm~2. The cooling solution target thermal resistance is being driven down continuously. The conventional air-cooled solution cannot meet the target thermal resistance being sought. One potential solution is a loop thermosyphon system. This paper presents a general overview of loop thermosyphons and their potential application to electronics cooling, presenting a brief history, operating principles, and potential integration options.