RELIABILITY ASSESSMENT OF A CSP ASSEMBLY USING A HIGHLY ACCELERATED MECHANICAL-THERMAL METHOD

摘要

A new Highly Accelerated Mechanical-Thermal (HAMT) test methodology was developed to reduce the thermal cycling testing time associated with assessing the reliability of PCB assemblies. In this paper, the setup and test method for the HAMT system is discussed. The test results for a CSP assembly, supported by a finite element (FE) simulation in which the fatigue life of solder joints is estimated from the calculated stress-strain history under the highly accelerated loading condition, is presented. The test and simulation results show that the new test method reduces the reliability testing time from months in comparison with conventional Accelerated Thermal Cycling (ATC) tests to days.