FLO/STRESS: AN INTEGRATED STRESS SOLVER FOR THE CFD TOOL FLOTHERM

摘要

The future of many electronics companies will depend to a large extent on their ability to initiate techniques that bring schedules, performance, tests, support, production, life-cycle-costs, reliability prediction and quality control into the earliest stages of the product creation process. An important question for engineers who are responsible for the quality of electronic parts such as circuit card assemblies (CCAs) during design, production, assembly and after-sales support is: What is the impact of temperature on the performance and reliability of the components and hence the whole system? At present, thermal and thermomechanical analyses are usually undertaken using different software tools that require separate model build and meshing. This leads to a large investment in time, and hence cost, to undertake each of these simulations. This paper details the development of a new thermal-stress module FLO/STRESS~(TM), integrated into the FLOTHERM~(TM) CFD software, thereby using a common data model and user interface. A discussion of its use within the product design process is given, followed by an example of this integrated modeling approach for a CBGA component, comparing the results with previously published reliability data.