Optoelectronics and photonics packaging

摘要

The Symposium on Optoelectronics and photonics Packaging (Trac#11) was held from June 13-17, 1999, in Maui, Hawaii, as part of the Pacific Rim/ASME Electronic Packaging Conference (INTERP ack'99). The intent was to bring together mechanical, materials, electrical, optical, chemical, and reliability engineers, as well as applied physicists, materials scientists, and chemists, to discuss the state of the art in the field of packaging of optoelectronics or photonic components and devices.