The opportunity is to develop a new material with high thermal conductivity and light weight and good functionality and reliability. This material has applications in laptop computer casese, convection heat sinks for processors and heat spreaders for wireless transmitters Innovations in integrated circuit manufacturing, design methodologies are leading to new generations of wireless, portable information technology products. Size and wieight along with functionality reliability are among the factors that distinguish these systems. A dual strategy of reduced power consumption and improved thermal management promises to greatly improve the performance capability of portable systems. A new thermal management material is proposed to be developed which perform better and possess competitive cost/performance balance compared to materials currently used in electronic products.
展开▼
