Optical interconnects for high-speed data links

摘要

Abstract: We demonstrate the integration of vertical-cavity surface- emitting laser (VCSEL) arrays with Si-dummy chips for potential use in short-distance parallel optical interconnects. An 8 $MUL 8 flip-chip bonded InGaAs VCSEL array was successfully modulated at data rates up to 0.8 Gbit/s/channel, corresponding to an aggregate data transmission capacity in excess of 50 Gbit/s. A 2 $MUL 4 VCSEL array was indirectly flit-chip bonded to a Si substrate via a transparent glass carrier and package- limited data rates of 0.4 Gbit/s/channel were achieved. The large signal modulation bandwidth of these devices exceeded 2 Gbit/s. The electrical driving characteristics of the devices were found to be compatible with 3.3 V CMOS technology. !15